5+ hour, 54+ min ago  (530+ words) South Korean semiconductor giant SK Hynix has announced a new type of high-bandwidth memory (HBM) for AI datacenters that improves heat dissipation by integrating a cooling layer within the memory package itself. The change could allow AI processors incorporating the…...

1+ mon, 1+ week ago  (28+ words) Semiconductor equipment corporations Applied Materials announced two new manufacturing systems on the 14th to form the minute structures of cutting-edge logic chips. The new technology unveiled by. .....

1+ week, 1+ day ago  (282+ words) Semiconductors are the invisible engines of modern life, quietly powering almost everything we rely on. From smartphones and laptops to cars, hospitals and national infrastructure, these tiny components support the systems that shape how we live, work and connect. But…...

10+ hour, 52+ min ago  (262+ words) I think I'll need to start a Go Fund Me. Corsair has just announced a new DDR5 memory design that has me wishing we were still living with 2024 prices. It's called Shugo, and is unfortunately only a limited edition, created "for…...

9+ hour, 59+ min ago  (312+ words) May 27, 2026, 08: 00 ET ORLANDO, Fla. and SEOUL, South Korea, May 27, 2026 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on May 27 that it will participate in the 2026 Electronic Components and Technology Conference (ECTC) to showcase its next-generation semiconductor package substrate technologies to global…...

15+ hour, 7+ min ago  (1319+ words) Tech Power Up Team Group to Showcase Quad-Rank CUDIMM ECC CUDIMM, and More at Computex 2026 - Designed for electrostatic discharge (ESD) risks in industrial environments, the Team Group INDUSTRIAL ECC CU-DIMM+ESD Protection Module integrates high-strength ESD protection technology with Team…...

23+ hour, 41+ min ago  (279+ words) May 26 (Asia Today) -- SK hynix has unveiled a new high-bandwidth memory (HBM) technology integrating cooling functions directly into the package, aiming to address rising heat issues in AI memory systems and strengthen its next-generation AI semiconductor competitiveness. The company announced…...

23+ hour, 29+ min ago  (371+ words) SK hynix on May 26 unveiled a new thermal management technology called "i HBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds. The key feature of i HBM is an integrated thermal control…...

11+ hour, 5+ min ago  (51+ words) ET CIO Micron joins $1 trillion club as AI race powers memory chip boom - Published On May 27, 2026 at 09: 09 AM IST Join the community of 2 M+ industry professionals. All about ETCIO industry right on your smartphone!...

20+ hour ago  (172+ words) Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The…...